Welcome Message

From General Chair
Joungho Kim (KAIST)
Conference General Chair,
The IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Symposium is the premier international conference in Asia Pacific region to share the recent progress of modeling, simulation and measurement for electrical design issues on chip, package, and system levels. The EDAPS symposium consists of paper presentations, industry exhibitions, workshops, and tutorials.

The APEMC2017 will be held in COEX, Seoul, Korea from December 14 to 16, 2015. The technical program of the symposium not only addresses current technical issues but also brings out challenges in IC designs, SiP/SoP packaging, EMI/EMC, EDA tools, and advanced 3D-IC and TSV designs. As in the previous events over a decade, the APEMC2017 will provide a major platform for researchers from academia and industry to exchange their knowledge and to build up networks. I look forward to meeting you soon at the IEEE APEMC2017.

Joungho Kim (KAIST)
Conference General Chair